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                Our Company Award in IMPACT-EMAP International Symposium

                更新時間:2015-03-27

                ?The 9th IMPACT (International Microsystems, Packaging, Assembly, Circuits Technology) and the 16th EMAP (International Conference on Electronics Materials and Packaging) joint conference (IMPACT-EMAP 2014) was held on October 22-24, 2014 in Taipei. The conference was hosted by IEEE CPMT-Taipei, IMAPS-Taiwan, Taiwan Industrial Technology Research Institute (ITRI) and Taiwan Printed Circuit Association (TPCA). The paper entitled “Application of Ni-B nanoparticles in Circuits Fabrication on Al2O3 Ceramics”, which was accomplished through the cooperation between the laboratory of associate Professor Cui Guofeng (School of Chemistry and Chemical Engineering, Sun Yat-sen University) and Huizhou Leadao Electronic Material Co., Ltd., was awarded the “PCB Best Paper Award” and the “Outstanding Paper Award”. It was also the only awarded paper from mainland China (http://www.impact.org.tw/2014/Award/).

                ?The IMPACT conference is an international annual event for electronic components, assembly, packaging, testing and printed circuit board (PCB) industry. This year, the 9th IMPACT conference was held in conjunction with the 16th EMAP conference which just rotates to Taipei, with the topics ranging from microelectronics, integrated circuit (IC) packaging, assembly and electronic materials, to PCB technologies. The conference attracted a lot of senior professors in famous institutes and top specialists in leading companies coming from America, Germany, Japan, South Korea, etc. Prof. Cui’s paper was aimed at addressing the processing issue regarding the metallization in circuit fabrication on ceramics surface. This paper described a protocol for ceramics surface pretreatment using Ni-B alloy, by which the problem involving the significant differences between the Al2O3 substrate and the conventional polymer substrate processing can be completely solved.

                ?Cui Guofeng was constantly devoted to application development of advanced electronic packaging technologies since he joined the faculty at Sun Yat-sen University as an assistant professor. His research has yielded plentiful results and won several awards at the IMPACT conference over the past few years, including one “Outstanding PCB Thesis Award-Gold Prize” award in 2010 and two “Outstanding PCB Thesis Award-Merit Prize” awards in 2012. Being awarded again this year, it is the recognition and praise from the PCB industry for his outstanding work.

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